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|  DSH 373
& X. M2 L8 Z7 |0 E* n. q
9 c( B9 ~9 J5 e8 _# q3 {+ ~; w9 q | Humidity conditioning
' A9 m; U D( {. [$ u9 M | 2.9.1 and 2.9.2
" B) o6 l7 N K" P7 B1 D | 60950(ed.3)" | x9 f4 k9 S3 Q0 @3 {/ z
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7 w+ O9 Y5 T2 ~7 y" B; B7 i; s# B
Standard:
' h' {$ H; k& hIEC60950, 3rd Ed.) v y) w' F% L( u9 J" @
Sub clause:, }0 T& |' y: m$ g3 }% {/ G
2.9.1 and 2.9.2
/ R) g J/ V9 H4 z* N; c. E1 R3 CSheet n. 373
% i5 o" s5 h) TPage 1 (1)
9 U2 u g* f- _4 [+ vSubject:0 q; T6 P; Y6 C) m! Y6 X1 i5 r: }, g
Humidity conditioning; h, z1 d' S- o! e/ y3 o0 Z4 u
Key words:
* h. I, z9 M( \9 X( y-Insulation
+ ?) {+ }3 s# g: U% G; J, Z-Humidity
+ [: y' M2 p4 ODecision confirmed. w. s: }. M- n* [4 j/ q
at CTL 38th meeting
7 d8 a/ U# Q' `: Z KQuestion:
$ N, @, n/ R. [! aSub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the
- `% E1 W; j$ v0 Vhumidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the
" S2 A2 X3 m5 @; l5 ^component or subassembly is not energized".
2 }6 h+ C( f' N3 t4 ~Can these requirements be interpreted in the way that only components and subassemblies# H9 Q0 c: w+ e
need to be subjected to the conditioning and not the equipment where these components3 q+ j8 n9 b- F! y' R' v: {
and/or subassemblies are mounted?
7 }9 W% Y' |2 z, {Decision:/ \, |* C! D9 R2 F
Yes.3 h" \" R& w5 n2 R6 ^7 h$ b# U
$ S, T7 i# c, p9 i) g( V2 }- S+ C3 k" }3 M. a# }. t
- x1 N5 ^+ R) U0 U
+ q% q. ]* q( N! y7 F |
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