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|  DSH 373
/ |" V4 J$ e, h& K& g2 a h
( I0 K# h+ Q+ K% m+ w7 O | Humidity conditioning6 U8 U5 h. z0 h* r/ k# \' ]
| 2.9.1 and 2.9.2
* w6 C( W( _ S | 60950(ed.3)
. l- k9 ?/ D, o& I# L |
! g+ ~3 H8 x0 |9 I# t" sStandard:
* n% A8 M. ]5 w0 r5 v% lIEC60950, 3rd Ed.* s7 o# s9 N, g6 A) [8 }" [
Sub clause:
; p: u0 L+ a/ S; {, |2.9.1 and 2.9.20 Q X0 U- i& _; Y6 X
Sheet n. 373
" Y7 y& q0 ]7 v) A. ]Page 1 (1)" |! u9 K a$ w, w2 A2 @
Subject:
. e. F; }1 ] T) O& ?' oHumidity conditioning
3 c/ i- x, E6 M# iKey words:8 c3 C m5 P6 U' L, n7 p- j8 o
-Insulation- l9 y7 g( f" i& P U0 s( Z
-Humidity, @2 U8 I. s+ ]7 P& j5 H! S6 P5 ?: W
Decision confirmed* k- B1 Z0 o: A7 i$ L: \2 u: |; I
at CTL 38th meeting3 X+ T, {9 q: c0 `# h- l. Y
Question:
, l% {( z5 M2 YSub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the* T6 o! t( [+ m4 i8 u6 l# j
humidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the
8 g: x6 Q# o! i0 f! \$ K; Fcomponent or subassembly is not energized".
9 W* U9 Z/ w. _$ E. MCan these requirements be interpreted in the way that only components and subassemblies- G: V/ n5 n( \) J) `
need to be subjected to the conditioning and not the equipment where these components
" T8 o! i( N' ~5 L' ]5 uand/or subassemblies are mounted?4 {' |! z8 i* `5 Y8 H
Decision:
% u# m6 ~1 p- }4 l$ g- GYes.7 y: f% V# {0 y, Q( { O
/ y3 ~9 w0 W: E, I5 Z7 Z- j
$ q+ D* N9 V6 b: S2 a
7 v' @! X" s; x3 Q- w, {" D& s+ m. a
8 k) ^3 v3 m7 i6 ]4 S
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