DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed

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DSH 380

Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards * G- a% b! k0 k

2.9.3, Table 6, Condition 3 8 [8 S" ?" @+ ?+ ^9 {$ e0 F

60950(ed.2) & 60950(ed.3)

4 U) ^: `; [" t3 w, ~0 r' tStandard:
IEC 60950, 2nd and 3rd Ed.
Sub clause:
7 y5 Y  v! A, ?" I! }2.9.3, Table 6, condition 3
( i) D# ], r4 R8 S  P6 nSheet n. 380
6 v( D$ o9 r0 [6 s# i  kPage 1 (1)
Subject:
Affect of solder resist on
Comparative Tracking Index (CTI)
of Printed Wiring Boards
5 `2 P) v# L0 }, Y8 ]/ YKey words:
-comparative tracking index
-CTI
/ ^- P  b' R: |1 C6 K% ]& }$ ?$ v1 c-printed wiring boards
-PWB
' l$ x. K  c; @& z- Y-solder resist
Decision confirmed
at CTL 38th meeting
Question:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
resist present can be different than that for the printed wiring board without the solder resist.
* W5 J0 o) k+ P3 fThe creepage distances required in the standard depends upon the CTI for the printed wiring
( @  }9 T' M& d, y/ j. qboard.
Should the presence of solder resist on a printed wiring board be considered in determining
2 P; M; v: |) O7 x+ b* a1 Tthe CTI when determining the creepage distances requirements to be applied?
+ g% ?  k' Q, LNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring
board is not covered with a conformal coating.
Decision:
Yes.
5 f1 ~" {' D5 M% k7 I# U, V

) b& [) d, g3 R; n( M0 f