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peter, 决议原文如下:2 ]9 u. y. s r2 d+ y; ]
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" V# ^' ^, C. y: A! ^1 _- lOSM/EE DECISION SHEET
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! y" o- U. L# j. {9 \Standard:
" |8 M, U! U2 x9 n; ^EN 60950:2000
B& r% N& j1 h) W" zEN 60950-1 :2001 Sub clause: 7 z; Q4 G. W* e% p
2.10.5 Sheet no. :
3 B- N6 a% K+ D: O% {) V. Q 95/171 o* z" o! u- s% y
5 A$ Y& j# N& i6 e3 o7 YPage: 1 of 1$ |4 T5 a) W9 y% M8 u7 |, C, A
Subject:
$ U3 ]2 F% y) r9 q! W4 z7 q( ~Insulation of plastic enclosure of semiconductor component Key words:
, k8 |$ z# _; B8 G0 T) nSemiconductor insulation Meeting: 2 Z2 q( u2 L( R& t
OSM/EE - 1995" c, {. i. I3 O) D: d
Item 9.14' {; V7 u- k) V: N& w& `8 u: O
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Question:
7 L( K* A0 \+ B6 gType of insulation of plastic enclosure of semiconductor component
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Decision:
' H5 B6 R! t8 J3 n7 h0 V2 DThe plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation. U u+ m# d2 u. R) W6 Z) W$ y6 v
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Explanatory Notes: - |
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